ODM & OEM Services

White-label networking hardware — your brand, our engineering. From chipset selection to FCC-certified finished product.

Development Process

Spec-to-Sample: 4 to 8 Weeks

A rigorously compressed development pipeline enabled by Shenzhen's vertically integrated supply chain. Every step happens within a 5km radius.

1
Week 1
Requirements & Feasibility
Technical brief review: target throughput, bands, ports, BOM cost, target volume, target markets. Chipset selection against cost/performance matrix. Regulatory requirements mapping (FCC/CE/MIC/etc). Preliminary BOM and timeline delivered within 72 hours.
2
Week 2–3
Schematic & PCB Layout
Reference design adaptation or ground-up schematic. RF layout with impedance-controlled traces. Antenna matching and isolation optimization. PCB fabrication at Longhua partners — 72-hour turnaround for 4-layer, 5-day for 8-layer+.
3
Week 3–4
Firmware Porting & Bring-Up
Board bring-up on chosen SDK (OpenWRT/QSDK/MTK SDK/Broadcom HND). Bootloader, kernel, wireless driver integration. Custom Web GUI skin applied to your brand guidelines. Multi-language support as required. TR-069/TR-369 agent for carrier deployments.
4
Week 4–6
Enclosure Design & Tooling
Industrial design based on your brand language or our proven reference enclosures. Thermal simulation for passive cooling design. Tooling kick-off for plastic injection molds. Simultaneous with PCB and firmware development to compress timeline.
5
Week 5–7
Integration & Pre-Compliance
Full system integration: PCBA + enclosure + antennas. Throughput testing, thermal validation, long-duration stability. Pre-compliance scanning for FCC Part 15, CE RED, Wi-Fi Alliance. Iterate on any failures before formal submission.
6
Week 7–8
EVT Samples & Certification
Engineering Validation Test samples shipped to you. Formal certification submission to accredited labs. Packaging design, manual, and regulatory label finalization. DVT (Design Validation Test) build at 50–100 units. Production ramp begins.

Silicon Platforms

Supported Chipsets

Deep engineering experience across all major networking silicon vendors. We are a qualified ODM partner for Qualcomm, MediaTek, Broadcom, and Realtek platforms.

Qualcomm

Networking Pro / Immersive Home
  • IPQ50xx — AX3000/AX5400 (WiFi 6)
  • IPQ807x — AXE7800/AXE11000 (WiFi 6E)
  • IPQ53xx/IPQ957x — BE5500–BE36000 (WiFi 7)
  • SDX62/X65/X75 — 5G CPE platforms

MediaTek

Filogic / Genio
  • MT7621A + MT7905/MT7975 — AX1800
  • MT7981/MT7986 — AX3000/AX6000 (Filogic)
  • MT7988 — BE19000 (WiFi 7 Filogic 880)
  • T750/T830 — 5G CPE platforms

Broadcom

StrataGX / HND
  • BCM4908 + BCM6710 — AX6000
  • BCM6858/BCM6859 — GPON ONT SoC
  • BCM53344/BCM5337x — Managed switch
  • BCM4912 + BCM6726/BCM67263 — WiFi 7

Realtek

RTL SoC / Switch
  • RTL8197F/RTL8198D — WiFi 5/WiFi 6
  • RTL8367S/RTL8370N — Unmanaged switch
  • RTL9313 — 10G managed switch
  • RT9603C — GPON ONT

Firmware Engineering

Firmware Customization

Your brand, your UX. Choose from open-source or proprietary firmware stacks — all customized with your logo, color scheme, and feature set.

OpenWRT / Custom Build

Full OpenWRT (or LEDE) build from source with your package selection. Custom LuCI theme matching your brand identity. Pre-configured firewall, QoS, VPN server/client. Auto-build CI/CD for OTA update delivery. Ideal for: tech-forward brands, community-supported products, maximum flexibility.

Qualcomm QSDK / MediaTek MTK SDK

Vendor-optimized SDK builds with full hardware acceleration. DFS/ACS support, carrier-grade Wi-Fi SON, EasyMesh controller. Virtual AP with per-SSID VLAN. Band steering, airtime fairness, client isolation. Ideal for: performance-focused consumer routers, enterprise APs, carrier CPE.

Carrier-Grade Firmware

TR-069 (CWMP) / TR-369 (USP) remote management. OMCI for GPON ONT. VoIP with SIP/H.248, T.38 fax, G.711/G.722/G.729 codecs. IPTV: IGMP proxy/snooping, VLAN tagging, IGMPv3 MLDv2. ACS provisioning with zero-touch deployment. Ideal for: ISPs, telcos, MSOs deploying at scale.

Web GUI & Mobile App

All firmware packages include a branded Web GUI. Optional companion mobile app (iOS + Android) for device onboarding, parental controls, and network diagnostics. Multi-language support: English, Spanish, Portuguese, French, German, Arabic, Russian, Japanese, and more.

Regulatory

Pre-Certification & Compliance

Navigate global regulatory requirements with our in-house pre-compliance capability. We catch issues before the formal lab submission, saving weeks of back-and-forth.

FCCPart 15B/15C/15EUSA — SDoC + modular grant
CERED 2014/53/EUEU — Radio Equipment Directive
UKCAUK Conformity AssessedUnited Kingdom
Wi-FiAllianceWi-Fi CERTIFIED 6/6E/7Interoperability certification
BluetoothSIGBT SIG QualificationBluetooth LE coexistence
ICISED RSS-247Canada
MICJapan Radio LawJapan — Giteki mark
NCCLP0002Taiwan
KCRRA NoticeSouth Korea
ANATELAct No. 14448Brazil

In-House Pre-Compliance Capability

We maintain an internal pre-compliance chamber for conducted and radiated emissions scanning (30MHz–6GHz). This allows us to identify and resolve EMC issues before formal lab submission, compressing the typical compliance cycle by 2–3 weeks. Full documentation package provided for your chosen certification lab.

Engagement Model

How We Work

Two engagement paths depending on where you are in your product journey.

Path A: Pick From Our Line

Select an existing SKU from our product line. We apply your logo, custom firmware Web GUI, branded packaging, and ship. Fastest path to market.

  • ▶NRE: $3,000–$8,000 (firmware branding + packaging)
  • ▶Sample lead time: 15–25 days
  • ▶MOQ: As listed per SKU

Path B: Custom Development

Build a new SKU from your specification. Ground-up PCB, custom enclosure, unique firmware. Full ODM ownership of the design.

  • ▶NRE: $15,000–$60,000 (scope-dependent)
  • ▶Development lead time: 4–8 weeks
  • ▶MOQ: Negotiable, typically 1,000+

Next Step

Submit Your Technical Brief

Tell us your target spec and we'll return a feasibility report, chipset recommendation, BOM estimate, and timeline within 48 hours. No commitment required.

Start Technical Brief